| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 11.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Cu base alloy consisting of - Sn (1-4%) - Zn (9-15%) - P (0.01-0.2%) - Fe (0.01-0.8%) - Al (0.001-0.1%) - Ni (0.001-0.5%) - Cu (Bal.) Said alloy including phosphide particles uniformly distributed throughout the matrix, having min particle size of 50 angstroems & max size of 0.5 microns for improving the stress relaxation properties of the alloy & including a finer comp with size 50-250 angstroem & coarser comp with size 0.075-0.5 microns |
| PATENT PHOTOCOPY | Available on request |
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