| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 03.00 |
| PATENT ASSIGNEE |
Dowa Mining Yazaki Corp |
| PATENT CLAIMS |
Coated Cu alloy comprising Cu alloy having a surface coating contg Sn, said Sn coating being formed by surface treat Cu alloy with Sn, followed by heat treat to cause heat diffusion so as to form surface coating consisting of Cu & Sn, said surface coating extending to a depth which includes at least the resultant interface between the Sn-contg layer & said Cu alloy, said surface coating having thickness 1-5 micro.m, wherein Cu alloy has compn - Zn (4.2%) - Fe (0.14 %) - Sn (1.03%) - P (0.05%) - Cu (Bal.) |
| PATENT PHOTOCOPY | Available on request |
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