| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 08.00 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Thermosetting adhesive resin system - Epoxy resin - Anhydride hardener - Imidazole catalyst - Fused silica filler |
| PATENT PHOTOCOPY | Available on request |
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