| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 12.00 |
| PATENT ASSIGNEE | Asahi Kasei Kogyo KK |
| PATENT CLAIMS |
- Selecting Polymeric polyimide precursor which has an amide bond d. = 1.5 - 2.42 mol/kg from the group of polyme ric aromatic polyimide precursor of formula -[-CO-C6H2(CO2-CH=CH2)2-CONH-Y-NH-]-; Y = structure bonded to at least 2 substituents, wherein an aromatic ring bonded to the NH substituent, or an aromatic ring adjacent to the aromatic ring bonded to the NH substituent via an O linker, is substituted with an electron-withdrawing group lacking H that is selected from the group: alkylcarbonyl, nitrile & arylsulfone - Applying a film of a photosensitive compn, which comprises the polymeric polyimide precursor, photo-polymn initiator & solvent, & which at thickness of 10 micro.m, exhibits an absorbance < 1.5 upon exposure to light of wavelength of 365 nm, to an article coverable by the film - Exposing the applied film to i-line light - Removing unexposed areas of the film with a developing soln to form a pattern - Heat-curing the resultant pattern |
| PATENT PHOTOCOPY | Available on request |
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