| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 06.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Heat curable compn - Polydiorganosiloxane (I) having unsaturation concn (0.118 -0.156 mole %) - Second (I) having unsaturation & plasticity 1.4 - 1.65 mm - Third (I) having unsaturation concn 1.37 - 2.24 mole % - Crosslinker contg Si-H bonds - Silica filler - Pt catalyst |
| PATENT PHOTOCOPY | Available on request |
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