| CLASSIFICATION | CommPat. Market |
| MARKETER'S COUNTRY | USA |
| PRODUCER'S COUNTRY | USA |
| UPDATE | 01.99 |
| MARKETING BY | This data is not available for free |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Electrolytic process for producing Cu foil having low profile surface exhibiting high peel strength when bonded to polymeric substrate, which process comprises: - Prepg an electrolyte comprising Cu sulfate-SO4H2 soln., said soln having added thereto minor amounts of low MW water-soluble cellulose ether, low MW water-soluble polyal kylene glycol ether, low MW polyethyleneimine & sulfona ted organic S compd - Passing direct electric current through electrolyte from prima ry anode to cathode spaced from primary anode in first electrodeposition zone under first mass transfer conditions including first current d. to electrodeposit on cathode a base Cu foil having fine-grained microstructure & a matte surface having micropeaks with height < 150 micro-inch - Passing base foil & electrolyte from first electrodeposition zone to second electrodeposition zone - Passing direct electric current through electrolyte from ano de to cathode under second mass transfer conditions inclu ding a second current d. > than first current d. & which provi de a mass transfer poorer than that in first electrodeposi tion zone, while introducing into the second electrodeposi tion zone a supplemental stream of the electrolyte, to elec trodeposit on matte surface micronodules of Cu, so as to produce a Cu foil having total matte height < 200 micro-inch |
| PATENT PHOTOCOPY | Available on request |
| PRODUCTION BY | This data is not available for free |
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