| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 07.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Multiple wire printed circuit board comprising printed conductor circuit layers, adhesive layers in which the wires having insulating coating are embedded & fixed, insulating layers & connecting through-holes formed at the locations where connections will be made, wherein each conductor circuit layer is insulated from other conductor circuit layers through insulating layers, & the difference in Tg between the adhesive layer & the adjoining insulating layer is within the range of 60C, wherein the adhesive layers contain - Polyimide (40-70%) derived from OC(Phthalic Anhydride)2 & (-C6H4-)(CO-C6H4-NH2)2 - Bismaleimide/diamine reaction prodt (14-45%) - Epoxy resin (15-45%) |
| PATENT PHOTOCOPY | Available on request |
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