| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 08.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
- Printing or coating a filling material for hollow portions & having a fluidity at B-stage on hollow portions of circuit subs trate - Drying, followed by curing to B-stage - Piling a Cu foil having a layer of insulating adhesive which is capable of forming via holes by chemical etching on one side so as to contact the insulating adhesive with the filling material coated surface, followed by lamination to form an integrated structure - Removing portions necessary for connection with the Cu foil by etching, & removing the insulating adhesive exposed to holes by chemical etching - Connecting the Cu foil with circuits exposed to the holes & forming a surface circuit by processing an outer layer of the Cu foil & - Repeating above steps depending on the number of circuit layers necessitated Said insulating adhesive comprising - Epoxy resin having MW < 1200 in amount: 30 - 100 parts - COOH-contg acrylic rubber (30 - 70 parts) - Epoxy resin cure agent - Cure accelerator |
| PATENT PHOTOCOPY | Available on request |
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