| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 07.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Process for mfg circuitry package comprising coating a substrate surface with compn - Crosslinkable resin with MW < 1000 & hydroxyl/oxirane < 0.1 - Resin with MW > 5000 & hydroxyl/oxirane > 2 - Photoinitiator Curing coating; depositing conductive material |
| PATENT PHOTOCOPY | Available on request |
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