| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 07.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Multilayer printed circuit board contg conductive through- holes which make electrical contact to a series of electrically conductive layers through > one insulating layers comprising - Dielectric layer (A) - Cu circuitry on one or 2 opposite sides of (A) - Layer of Bi oxide which overlays Cu circuitry - Organosilane layer - Insulating layer comprising cured thermosetting polymer compn |
| PATENT PHOTOCOPY | Available on request |
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