| PATENT ASSIGNEE'S COUNTRY | Italy |
| UPDATE | 12.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
Process for deposition thick coatings having thickness > 1 mm onto Cu - Surface activation of Cu - Deposition of first layer onto Cu - Thermal stabn at 20-400C - Deposition of Al intermediate layer by thermal spraying - Thermal stabn at 20-300C - Deposition of thick coating by thermal spraying |
| PATENT PHOTOCOPY | Available on request |
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