| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 04.99 |
| PATENT ASSIGNEE |
Japan Atomic Energy Research Institute NGK Insulators |
| PATENT CLAIMS |
- Disposing Be-Cu layer contg Be & Cu (> 50%) & thickness 0.3-3 mm between pure Cu & pure Be - Heating for diffusion bonding |
| PATENT PHOTOCOPY | Available on request |
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