| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 11.99 |
| PATENT ASSIGNEE | This data is not available for free |
| PATENT CLAIMS |
In a method of mfg printed wiring board assembly; comprising making a substrate preform intermediate material having glass fabric reinforcement impregnated with MeOH soln. comprising - 5-Norbornene-1,2-dicarboxylic acid anhydride di-Me es ter (1 mole) - 3,3',4,4'-Benzophenone tetracarboxylic acid di-Me ester (1.0356 mole) - 3,4'-Oxydianiline (1.5356 moles) Inducing prolonged condensation reaction at first T (I) - Inducing crosslinking reaction in vacuum at T > (I) |
| PATENT PHOTOCOPY | Available on request |
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