| PATENT ASSIGNEE'S COUNTRY | USA |
| UPDATE | 12.99 |
| PATENT ASSIGNEE | Sandia (Livermore; Ca) |
| PATENT CLAIMS |
Bi-layer photoresist for replicating a patterned array of features on a surface of a substrate material comprising - Planarizing layer applied to & covering said substrate surfa ce, wherein said planarizing layer is novolac & > 0.5 micro. m thick - Imaging layer selected from group: poly(cyclohexylmethyl- co-trimethylsilylmethyl silane), B carbide, V oxide, Mo oxide said layer at least partially transparent to radiation with wavelength 15-4.5 nm & 0.1-0.2 micro.m thick |
| PATENT PHOTOCOPY | Available on request |
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