Main > ELECTRICAL > Circuit > Printed Circuit > Board > Adhesive > Poly(Carbodiimide)

Product Japan. S

PATENT ASSIGNEE'S COUNTRY Japan
UPDATE 06.99
PATENT ASSIGNEE Shin-Etsu Chemical
PATENT CLAIMS Coverlay film fabricated using resin contg repeat unit
- -(-R-N=C=N-)n-; R = Divalent hydrocarbon group; n = 5-250
The resin-contg adhesive cured at 200-400C
PATENT PHOTOCOPY Available on request

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