| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 09.99 |
| PATENT ASSIGNEE | Shin-Etsu Chemical |
| PATENT CLAIMS |
Board comprising substrate & circuit-pattern film formed thereon, said film comprising a photo-crosslinked layer & Ag conductive layer formed on photo-crosslinked layer, said circuit-pattern layer being formed by - Exposing to light, selectively in circuit pattern, a film of an organopolysiloxane having a H-Si bond on a substrate, thereby forming the photo-crosslinked layer in circuit pattern in the exposed area - Removing the unexposed area - Contacting the photo-crosslinked pattern with Ag salt to form Ag conductive layer on photo-crosslinked layer in the circuit pattern |
| PATENT PHOTOCOPY | Available on request |
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