| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 11.99 |
| PATENT ASSIGNEE | Sumitomo Bakelite |
| PATENT CLAIMS |
Insulating adhesive for multilayer printed circuit board - Bisphenol epoxy resin with MW > 10,000 - Bisphenol epoxy resin with EEW < 500 - 2-Methylimidazole cure agent |
| PATENT PHOTOCOPY | Available on request |
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