| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 09.99 |
| PATENT ASSIGNEE | TDK |
| PATENT CLAIMS |
Mfg method comprising wet molding in magnetic field a slurry contg particulate oxide material & water to form molded part, wherein - The slurry contains dispersant comprising compd having -OH & -COOH & - Compd having an enol form -OH dissociable as an acid - Said organic compd has 3-20 C - Different -OH is attached to each of > 50% of the C atoms which form no double bond with O atom |
| PATENT PHOTOCOPY | Available on request |
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