| PATENT ASSIGNEE'S COUNTRY | Japan |
| UPDATE | 10.99 |
| PATENT ASSIGNEE | Tokyo Ohka Kogyo |
| PATENT CLAIMS |
Process for treat. a substrate which has been provided with a resist pattern & subjected to an etching treat - Treat resist pattern with remover soln contg salt of HF & non-metal base - Rinsing substrate with soln contg ethylene glycol (5-60%) & non-glycol water-soluble organic solvent (40-95%) - Washing substrate with water |
| PATENT PHOTOCOPY | Available on request |
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