PATENT ASSIGNEE'S COUNTRY | Japan |
UPDATE | 07.99 |
PATENT ASSIGNEE | Toshiba KK |
PATENT CLAIMS |
Formed by simultaneously sintering Al nitride substrate & metal layer consisting of metal material - Tungsten (main comp) - Mn (0.001-2%) - Cu (0.0001-2%) |
PATENT PHOTOCOPY | Available on request |
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