Main > ELECTRICAL > Circuit > Board > Cover Protection Films > Patent. > Claims > Claim 1: FluoroPolymer Composite F > Coated with Polymer Adhesive Resin > Claim 2: Non-Porous PolyImide Film

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Claim 2: Non-Porous PolyImide Film's subsections
Claims 5,6: Adhesive PolyImide.

Claim 2: Non-Porous PolyImide Film's products
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