Main > ELECTRICAL > Circuit > Board > Cover Protection Films > Patent. > Claims > Claim 1: FluoroPolymer Composite F > Coated with Polymer Adhesive Resin > Claim 2: Non-Porous PolyImide Film > Claims 5,6: Adhesive PolyImide.

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Claims 5,6: Adhesive PolyImide.'s subsections
Claim 7: PolyTetraFluoroEthylene

Claims 5,6: Adhesive PolyImide.'s products
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