Main > ELECTRICAL > Circuit > Board > Cover Protection Films > Patent. > Claims > Claim 1: FluoroPolymer Composite F > Coated with Polymer Adhesive Resin > Claim 2: Non-Porous PolyImide Film > Claims 5,6: Adhesive PolyImide. > Claim 7: PolyTetraFluoroEthylene > Patent Assignee
Patent Assignee's products
Japan. J